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Thermal Interface Materials

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Additive Manufacturing Aerogel Application Highlight Automotive Battery Bio-Based Insulation Blending Brochure Building Materials Ceramics Composites Dielectric Dynamic Mechanical Analysis Effusivity Electronics Emissivity Energy Storage Explosives Fiber/Fibre Flex Transient Plane Source FLEX Transient Plane Source (TPS) Foams Geology Graphene Heat Transfer Fluids Insulation Liquids Metals Modified Transient Plane Source (MTPS) Method Nanomaterials Oil and Gas Optics Paste Phase Change Materials Photovoltaic Plastics Polymers Potting Compounds Powders Semiconductor TAL Textiles Thermal Analysis Thermal Conductivity Thermal Interface Materials Thermal Management Systems Thermal Radiation Thermoelectrics Thin Films Transient Hot Wire (THW) Transient Line Source (TLS) Method
Trident™ Thermal Conductivity Application Highlight: Thermal Interface Materials Under Compression
The thermal conductivity of silicone and non-silicone thermal interface materials (TIMs) under different compressed states was measured using the Transient Plane Source (TPS) method. Thermal...
Trident™ Thermal Conductivity Application Highlight: Thermal Interface Materials Under Compression
The thermal conductivities of silicone and non-silicone thermal interface materials (TIMs) under different compressed states were measured using the Transient Plane Source (TPS) method. Compression...
Trident™ Thermal Conductivity Application Highlight: Potting and Impregnation Materials
The following Application Highlight addresses the measurement of materials used for potting and impregnation applications using the Modified Transient Plane Source (MTPS) method. Potting and...
Trident™ Thermal Conductivity Application Highlight: Accelerated Thermal Conductivity Testing of Aerogels with MTPS
The following Application Highlight features the use of the Modified Transient Plane Source method in the thermal conductivity testing of aerogels.  Aerogels represent a class of ultra-lightweight...
Trident™ Thermal Conductivity Application Highlight: Thermal Mapping and Filler Settling Detection in Polymer Composites With MTPS
The following Application Highlight features the use of the Modified Transient Plane Source method as a qualitative screening tool for the detection of filler dispersion uniformity in polymer...
Trident™ Thermal Conductivity Application Highlight: Measuring Thin Film Samples using Flex TPS Sensor
The following Application Highlight addresses the measurement of polymeric thin films using the Flex Transient Plane Source (TPS) sensor and the Thin Films utility available on Trident.   Thin...
Trident™ Thermal Conductivity Application Highlight: Monitoring Resin Stability and Sedimentation with MTPS
The following Application Highlight summarizes the use of C-Therm’s MTPS method in monitoring the stability of a filled resin system.  Thermally conductive adhesives are a key component for...
Trident™ Thermal Conductivity Application Highlight: Characterizing Performance of a Thermal Adhesive for EV Battery Packs
The following Application Highlight addresses the measurement of both an uncured and cured thermal adhesive material using the Modified Transient Plane Source (MTPS) method in collaboration with HB...
Trident™ Thermal Conductivity Application Highlight: Characterizing Thermal Performance of Self-Adhesive Tapes for EV Battery Applications
The following Application Highlight addresses the measurement of self-adhesive tapes using the Modified Transient Plane Source (MTPS) method in collaboration with tesa tapes. Pressure sensitive...

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