A Division of C-Therm

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Trident™ Application Highlight: Accelerated Performance Validation of Thermal Adhesives for EV Battery Packs

This document highlights the use of the Modified Transient Plane Source (MTPS) method in the measurement of uncured and cured thermal interface materials during R&D formulation development. HB...

Development of thermal conductive paste for enhancing the heat transfer rate in electrical and electronic devices

Abstract: The growth in modern micro or nano electronic chips and electrical devices in the market, with the aim for developing a highly efficient processing machine. However, heat dissipation is a...