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Additive Manufacturing Aerogel Application Highlight Automotive Battery Bio-Based Insulation Blending Brochure Building Materials Ceramics Composites Dielectric Dynamic Mechanical Analysis Effusivity Electronics Emissivity Energy Storage Explosives Fiber/Fibre Flex Transient Plane Source FLEX Transient Plane Source (TPS) Foams Geology Graphene Heat Transfer Fluids Insulation Liquids Metals Modified Transient Plane Source (MTPS) Method Nanomaterials Oil and Gas Optics Paste Phase Change Materials Photovoltaic Plastics Polymers Potting Compounds Powders Semiconductor Specific Heat Capacity (Cp) TAL Textiles Thermal Analysis Thermal Conductivity Thermal Interface Materials Thermal Management Systems Thermal Radiation Thermoelectrics Thin Films Transient Hot Wire (THW) Transient Line Source (TLS) Method
Trident™ Application Highlight: Impact of Saturation on the Thermal Conductivity of Subsurface Geomaterials
This document highlights the use of the Transient Plane Source (TPS) method to characterize the thermal conductivity of sandstone and shale core samples at varying saturation levels, in accordance...
Use of Thermomechanical Analysis (TMA) in Sintering Simulation of Ceramics
The sintering process of ceramics or metal injection molding (MIM) can be divided into the debinding and the sintering processes. Conventionally, TG-DTA (STA) is used to investigate the debinding...
Trident™ Thermal Conductivity Application Highlight: The Role of Thermal Conductivity in Electric Motors
In electric motor (e-motor) applications, thermal management is a critical design consideration due to the high power densities and compact packaging typical of modern systems. As motors operate,...
Thermal Behavior of Paraffin Wax by Sample Observation DSC
Phase change material or PCM is a material that can absorb, store and release large amounts of latent heat within a specific temperature range during phase transition reaction. Several materials have...
Glass Transition Measurement with DMA
Historically, Tg has been characterized by DSC (Differential Scanning Calorimetry), which is a thermo-analytical method monitoring the difference in heat flow between the material’s specimen and a...
Thermal Analysis of PCB by TMA
A printed circuit board or PCB is usually composed of epoxy resin with reinforced woven glass fibers where electrical components and conducting layers are mounted. The PCB board and the components...
Trident™ Application Highlight: Thermal Conductivity of Thermal Interface Materials Under Compression
This document highlights the use of the Transient Plane Source (TPS) method to characterize the thermal conductivity of silicone and non-silicone thermal interface materials (TIMs) under varying...
Trident™ Application Highlight: Thermal Conductivity and Effusivity of Latex and Non-Latex Condoms
This document highlights the measurement of thermal conductivity and thermal effusivity of latex and non-latex condoms using the Transient Plane Source (TPS) Thin Films Utility and the Modified...
Trident™ Thermal Conductivity Application Highlight: Measuring the Through-Plane Thermal Conductivity of Gas Diffusion Layers
The following Application Highlight addresses the through-plane thermal conductivity measurement of two gas diffusion layer membranes on the C-Therm Trident FLEX Thin Films Module. Understanding the...

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