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Additive Manufacturing Aerogel Application Highlight Automotive Battery Bio-Based Insulation Blending Brochure Building Materials Ceramics Composites Dielectric Dynamic Mechanical Analysis Effusivity Electronics Emissivity Energy Storage Explosives Fiber/Fibre Flex Transient Plane Source FLEX Transient Plane Source (TPS) Foams Geology Graphene Heat Transfer Fluids Insulation Liquids Metals Modified Transient Plane Source (MTPS) Method Nanomaterials Oil and Gas Optics Paste Phase Change Materials Photovoltaic Plastics Polymers Potting Compounds Powders Semiconductor TAL Textiles Thermal Analysis Thermal Conductivity Thermal Interface Materials Thermal Management Systems Thermal Radiation Thermoelectrics Thin Films Transient Hot Wire (THW) Transient Line Source (TLS) Method
Use of Thermomechanical Analysis (TMA) in Sintering Simulation of Ceramics
The sintering process of ceramics or metal injection molding (MIM) can be divided into the debinding and the sintering processes. Conventionally, TG-DTA (STA) is used to investigate the debinding...
Trident™ Thermal Conductivity Application Highlight: The Role of Thermal Conductivity in Electric Motors
In electric motor (e-motor) applications, thermal management is a critical design consideration due to the high power densities and compact packaging typical of modern systems. As motors operate,...
Thermal Analysis of PCB by TMA
A printed circuit board or PCB is usually composed of epoxy resin with reinforced woven glass fibers where electrical components and conducting layers are mounted. The PCB board and the components...
Trident™ Thermal Conductivity Application Highlight: Thermal Interface Materials Under Compression
The thermal conductivities of silicone and non-silicone thermal interface materials (TIMs) under different compressed states were measured using the Transient Plane Source (TPS) method. Compression...
Trident™ Thermal Conductivity Application Highlight: Measuring Thermal Properties Under Cryogenic Conditions
The following Application Highlight features the use of the FLEX Transient Plane Source method in thermal conductivity testing under cryogenic conditions. One of the most common variables...
Trident™ Thermal Conductivity Application Highlight: Testing Polymer Melts Using the TLS-HT300 Needle Probe
The following Application Highlight features the use of the Transient Line Source (TLS) method in the thermal conductivity testing of polymer at elevated temperatures. In recent years, the...
Heat transfer in phase change materials for integrated batteries and power electronics systems
An integrated batteries and power electronics system has great potential in improving the compactness, flexibility and multifunctionality in electrical vehicles. However, it needs to overcome thermal...
Characterization of Aging Effects on Thermal and Mechanical Properties of Magnetically-Oriented ACA for Flexible and Stretchable Electronics
Next-generation electronics will rely heavily on easily customizable electronic devices and systems that can be quickly and affordably manufactured and integrated using various deposited materials on...
Trident™ Thermal Conductivity Application Highlight: Measuring Thin Film Samples using Flex TPS Sensor
The following Application Highlight addresses the measurement of polymeric thin films using the Flex Transient Plane Source (TPS) sensor and the Thin Films utility available on Trident.   Thin...

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